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MV-35 solder wave system
  • Compact benchtop solder aggregate - small size
  • Cost-effective and efficient solution
  • Built-in control computer
  • Recommended for small and medium scale production
  • Ease to use
Application

  • Industrial soldering of boards planded with through hole components
  • Running an efficient and economical production of circuit boards on small and medium scale
Advantages

  • Easy to read display
  • Low power consumption
  • Small batch weight - lower investment costs in a binder
  • Short warm up time
  • Fine adjustment of the conveyor speed, wave height and soldering time
Technical data

  • Max. wave height: 5-12 mm
  • Max. PCB size: 200 x 270 mm
  • Batch weight: 37 kg
  • Temperature range: 200-300 oC
  • Preheat temperature: 70-90 oC
  • Preheater power: 3 kW
  • Warm up time: 60 minutes
  • Fluxer type: foam
  • Conveyor speed: 0.5 - 3 m/min.
  • Dimensions: 850 x 600 x 330 mm
  • Weight: 48 kg
  • Power supply: 230 VAC, 50 Hz

Standard equipment
Optional equipment
  • Work with lead free solder
  • Single or double soldering wave (depends on model)
  • Built-in control PC 
  • Compressor 
  • Double pre heating with forced air circulation 
  • Wave and flux sensors 
  • Collecting excess of solder 
  • Interface RS-232
  • Stand 
  • Air-knife for collecting excess of flux 
  • Additional pallets 
  • Extended pallets 
  • Nitrogen inerting