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Preheater HP-580
  • Aluminium hot plate assures excellent energy transfer to preheated application 
  • Automatic process control and fault signalling 
  • Precise, digital control and temperature measurement 
  • Three digit display 
  • Even heating of whole hot plate area 
  • Safety device against overheating
Application
HP-580 hot plate after choosing right stencil and solder balls in an excellent set for fast and always effective BGA and ┬ÁBGA components regeneration.
  • BGA regeneration 
  • PCB preheating before rework process 
  • Solder removal 
  • SMD/BGA rework
Advantages
  • Precise digital steering and controlled PCB preheating  
  • Excellent co-operation with hot air rework stations, enables to build very effective work station and possibility of performing all kind of repairs, even the newest equipment
Technical data
  • Input power:  230 V AC 
  • Max. power consumption: 1150 W 
  • Temperature range: 350o
  • Dimensions: 200 x 146 x 200 mm 
  • Weight: 4.75 kg