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Set for SMD/BGA reworks A3
Application
  • Cooperation with preheater and station stand, enables performing works impossible to do by manual operation and components positioning 
  • REPAIR KIT FOR:
    • X-BOX
    • PLAY STATIONS
    • GRAPHIC CARDS
    • NOTEBOOKS
    • MOBILE PHONES
    • TELECOMMUNICATION EQUIPMENT
    • MOTHERBOARDS
    • OTHER BIG PCBs
  • 12 months warranty
Set contains
Microprocessor RA-250e station for hot air assembly and disassembly of SMD/BGA components.
Microprocessor controlled.



PCB preheater RE-PH-A3 - convection heating with a high heat capacity heating plate.
Large working area: 300 x 420 mm




Stand - stabile plate attachement and precise positioning of a component.
Adjustment of X, Y, Z. 
PCB mounting with dimensions of 480 x 300 mm.




Software for RE-RA250 station - menagement of the set, programming, process control and archiving.
Software provides control and modification of the process at the PC monitor.




Nozzles
With set - one standard nozzle
Optional - square nozzles




Adapter for nozzles - enabling use of REECO nozzles with stations of many manufacturers.




Vacuum tweezer allows you to lift components. Included with the tweezer are also 3 rubber suction cups for different sizes of components.




Thermocouple type K - temperature control
One thermocouple attached to the station and three thermocouples supplied with the preheater

Set possibilities

BGA assembly and disassembly unusually arranged on the PCB (layout oblique)
Motherboards, Networking


Repair of large main PCBs

Repair of odd shaped PCBs

Assembly and disassembly of small components
Repair:
Mobile phones
PDA
MDA
Xbox

Repair of video cards, sound cards, etc.

Repair of network devices